DeepMaterial's multi-purpose UV-curing adhesive can quickly polymerize and cure under ultraviolet radiation, which helps to greatly improve production efficiency. Widely used in bonding, wrapping, sealing, reinforcing, covering and sealing purposes. DeepMaterial multi-purpose UV curing adhesive is a one-component solvent-free product, which can be cured in a few seconds under UV or visible light. It has a fast curing speed, high bonding strength, large curing depth, good toughness, and anti-yellowing.

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DeepMaterial adheres to the research and development concept of "market priority, close to the scene", and strives to fully meet the current rapid development of electronic products, update the current situation of itera- tion, and continuously improve products, fully meet the requirements of high-speed assembly process of electronic products, and be compatible with solvent-free environmental protection technology, To ensure that customer's production cost and efficiency are improved and the production concept of environmental protection and high efficiency is realized. The DeepMaterial multi-purpose UV curing adhesive product line covers the main applications of structural bonding. DeepMaterial multi-purpose UV curing adhesive in electronic compo- nents for temporary fixation, PCBA and port sealing, line coating and reinforcement, chip mount, protection and fixing coating, metal and glass high strength bonding, medical industry device bonding, component solder joints, LED Lamp strip bonding, horn film and coil bonding, camera focal length positioning /LENS bonding and other scenarios are widely used.

To know more - https://www.deepmaterialcn.com/uv-curing-uv-adhesive.html

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